Due to their special shapes and performance requirements, the bonding process is of great significance in the assembly and application of special-shaped ceramic structural parts.
First of all, the bonding process has a certain applicability for special-shaped ceramic structural parts. Compared with traditional connection methods, bonding can avoid excessive mechanical stress on ceramic parts, especially for special-shaped structures with complex shapes that are difficult to mechanically fasten or weld. For example, some ceramic parts with fine curved surfaces or thin-walled structures can be connected by bonding without destroying their structural integrity. At the same time, bonding can also provide good sealing performance. For special-shaped ceramic structural parts that need to work in specific environments, such as preventing liquid or gas leakage in the chemical industry, the bonding process can meet this requirement.
However, there are many challenges and ways to improve the bonding strength of special-shaped ceramic structural parts. First, the choice of adhesive is crucial. It is necessary to select a suitable adhesive according to the type of ceramic material, the working environment and the stress of the structural parts. For example, for special-shaped ceramic structural parts working in high temperature environment, high temperature resistant organic silicone adhesive or inorganic adhesive should be selected; for structural parts subject to large shear force or tension, epoxy adhesive with high bonding strength and toughness should be selected. Second, pretreatment of ceramic surface is a key step to improve bonding strength. Increasing the roughness and active groups of ceramic surface by grinding, chemical etching and other methods can improve the wettability and adhesion of adhesive on ceramic surface. For example, slight etching of ceramic surface by hydrofluoric acid can effectively remove impurities and inert layer on the surface, so that adhesive can better bond with ceramic.
In addition, optimization of bonding process parameters has a significant impact on bonding strength. This includes adhesive layer thickness, curing temperature, curing time, etc. Appropriate adhesive layer thickness can ensure uniform distribution of adhesive and fully fill the connection gap, generally between 0.1 - 0.5 mm is more suitable. Curing temperature and time need to be precisely controlled according to the characteristics of adhesive. Too high or too low temperature, too long or too short time will lead to decreased bonding strength. For example, some epoxy adhesives can achieve the best bonding effect when cured at 80℃ - 120℃ for 2 - 4 hours.
Finally, the use of auxiliary reinforcement measures can also improve the bonding strength. For example, adding fiber reinforcement materials, such as carbon fiber or glass fiber cloth, to the bonding part can effectively improve the tensile and shear resistance of the bonded joint. In addition, appropriate post-treatment of the bonded structural parts, such as heat treatment or applying a certain amount of pressure, can further eliminate the stress in the adhesive layer and make the bonding stronger. In short, by comprehensively considering multiple factors such as adhesive selection, surface pretreatment, process parameter optimization, and auxiliary reinforcement measures, the bonding strength of special-shaped ceramic structural parts can be effectively improved to meet its application needs in different fields.
